In a strategic move that reshapes the smartphone industry landscape, Google has secured a multi-year partnership with Taiwan Semiconductor Manufacturing Company (TSMC) to produce Tensor chips for its future Pixel smartphones. The agreement, spanning from 2025 through to at least 2029, marks a significant departure from Google’s previous reliance on Samsung Foundry.
The landmark deal encompasses the production of Tensor chips for multiple generations of Pixel devices, from the upcoming Pixel 10 through to the Pixel 14 series. At the heart of this transition lies TSMC’s advanced 3-nanometer (nm) process node, which will debut with the Tensor G5 chip, promising substantial improvements in energy efficiency and thermal management.
This shift addresses longstanding concerns about the performance of Samsung-produced Tensor chips, which, despite their innovative AI capabilities, have faced criticism for thermal performance and power efficiency. The Tensor G4, currently powering the Pixel 9 series, utilises Samsung’s Exynos 2400 modem and older packaging technologies, highlighting the limitations of the previous manufacturing partnership.
Google’s alliance with TSMC positions the tech giant alongside industry leaders Apple and Qualcomm, both of whom have consistently relied on TSMC’s superior foundry capabilities. This strategic alignment is particularly crucial for Google’s AI-focused smartphone strategy, as improved thermal efficiency becomes increasingly vital for managing sophisticated artificial intelligence features.
The partnership, finalised after high-level discussions between Google executives and TSMC representatives in Taiwan, demonstrates Google’s commitment to enhancing its semiconductor capabilities. While official announcements are pending, industry analysts confirm that the collaboration terms have been definitively established.
TSMC’s advanced process node technology offers multiple advantages beyond power efficiency. The manufacturing breakthrough enables denser chip designs, potentially leading to more compact components and cost optimisation. However, experts note that overall performance improvements will require comprehensive architectural enhancements, including advanced CPU cores and increased clock speeds.
Looking ahead, the collaboration’s scope extends beyond the initial 3nm Tensor G5 chip. Industry sources suggest that subsequent iterations, including the Tensor G6 planned for the Pixel 11, may utilise TSMC’s even more sophisticated 2nm process, ensuring Google’s continued access to cutting-edge semiconductor technology.
This strategic partnership transcends mere technical advancement, signalling Google’s intensified commitment to competing in the premium smartphone market. By securing TSMC’s industry-leading manufacturing capabilities, Google positions itself to narrow the performance gap with established competitors who have historically benefited from TSMC’s superior chip production expertise.
The implications of this partnership extend through the latter half of the decade, promising enhanced chip efficiency, superior heat management, and improved overall performance for future Pixel devices. This technological evolution reinforces Google’s dedication to delivering sophisticated smartphones with advanced AI capabilities, ensuring their competitiveness in an increasingly demanding mobile market.
News Source: https://9to5google.com/2025/05/25/google-pixel-tensor-chips-tsmc-few-years-report/
